JPS6358376B2 - - Google Patents

Info

Publication number
JPS6358376B2
JPS6358376B2 JP55119810A JP11981080A JPS6358376B2 JP S6358376 B2 JPS6358376 B2 JP S6358376B2 JP 55119810 A JP55119810 A JP 55119810A JP 11981080 A JP11981080 A JP 11981080A JP S6358376 B2 JPS6358376 B2 JP S6358376B2
Authority
JP
Japan
Prior art keywords
electrode
gate
emitter
cathode
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55119810A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56131955A (en
Inventor
Tsutomu Yao
Masami Naito
Takahiro Nagano
Tomiro Yasuda
Hitoshi Oonuki
Mitsuo Yanagi
Fumio Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11981080A priority Critical patent/JPS56131955A/ja
Priority to DE3134074A priority patent/DE3134074C2/de
Publication of JPS56131955A publication Critical patent/JPS56131955A/ja
Priority to US06/621,370 priority patent/US4542398A/en
Publication of JPS6358376B2 publication Critical patent/JPS6358376B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
    • H01L23/4824Pads with extended contours, e.g. grid structure, branch structure, finger structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D18/00Thyristors
    • H10D18/60Gate-turn-off devices 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/133Emitter regions of BJTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/27Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/281Base electrodes for bipolar transistors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/27Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/291Gate electrodes for thyristors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01005Boron [B]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01006Carbon [C]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01013Aluminum [Al]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01014Silicon [Si]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01015Phosphorus [P]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01027Cobalt [Co]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01029Copper [Cu]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01033Arsenic [As]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01042Molybdenum [Mo]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01047Silver [Ag]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01074Tungsten [W]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01078Platinum [Pt]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01082Lead [Pb]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701Low temperature co-fired ceramic [LTCC]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301Thyristor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19043Component type being a resistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Thyristors (AREA)
  • Die Bonding (AREA)
JP11981080A 1980-09-01 1980-09-01 Semiconductor device Granted JPS56131955A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP11981080A JPS56131955A (en) 1980-09-01 1980-09-01 Semiconductor device
DE3134074A DE3134074C2 (de) 1980-09-01 1981-08-28 Halbleiterbauelement zum Steuern großer Ströme
US06/621,370 US4542398A (en) 1980-09-01 1984-06-18 Semiconductor devices of multi-emitter type

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11981080A JPS56131955A (en) 1980-09-01 1980-09-01 Semiconductor device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP3334580A Division JPS56130969A (en) 1980-03-18 1980-03-18 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS56131955A JPS56131955A (en) 1981-10-15
JPS6358376B2 true JPS6358376B2 (en]) 1988-11-15

Family

ID=14770786

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11981080A Granted JPS56131955A (en) 1980-09-01 1980-09-01 Semiconductor device

Country Status (3)

Country Link
US (1) US4542398A (en])
JP (1) JPS56131955A (en])
DE (1) DE3134074C2 (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0694964A2 (en) 1994-07-27 1996-01-31 Hitachi, Ltd. Semiconductor device and package structure therefor and power inverter having semiconductor device

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5986260A (ja) * 1982-11-10 1984-05-18 Hitachi Ltd ゲ−トタ−ンオフサイリスタ
DE3468787D1 (en) * 1983-03-31 1988-02-18 Bbc Brown Boveri & Cie Semiconductor power device and method of manufacture
DE3406537A1 (de) * 1984-02-23 1985-08-29 Brown, Boveri & Cie Ag, 6800 Mannheim Anordnung eines leistungshalbleiterbauelementes auf einem isolierenden und mit leiterbahnen versehenen substrat
JPS60194565A (ja) * 1984-03-15 1985-10-03 Mitsubishi Electric Corp 半導体装置
JPH065685B2 (ja) * 1984-06-20 1994-01-19 株式会社日立製作所 加圧接触形半導体装置
DE3424222A1 (de) * 1984-06-30 1986-01-09 Brown, Boveri & Cie Ag, 6800 Mannheim Abschaltbarer thyristor
GB2162366B (en) * 1984-07-24 1987-09-30 Westinghouse Brake & Signal Semiconductor device contact arrangements
JPS61113249A (ja) * 1984-11-08 1986-05-31 Mitsubishi Electric Corp 半導体装置
JPS61189668A (ja) * 1985-02-19 1986-08-23 Mitsubishi Electric Corp 半導体装置
JPS61208873A (ja) * 1985-03-13 1986-09-17 Res Dev Corp Of Japan 圧接構造型両面ゲ−ト静電誘導サイリスタ
JPH0719784B2 (ja) * 1985-10-02 1995-03-06 株式会社日立製作所 平形半導体装置
JPH0666463B2 (ja) * 1986-08-18 1994-08-24 三菱電機株式会社 ゲ−トタ−ンオフサイリスタ装置
DE3787721D1 (de) * 1987-02-24 1993-11-11 Bbc Brown Boveri & Cie Steuerbares Leistungs-Halbleiterbauelement.
EP0328778B1 (de) * 1988-01-26 1992-03-11 Asea Brown Boveri Ag Hochleistungsschalter
EP0380799B1 (de) * 1989-02-02 1993-10-06 Asea Brown Boveri Ag Druckkontaktiertes Halbleiterbauelement
JPH0831606B2 (ja) * 1989-11-17 1996-03-27 株式会社東芝 大電力用半導体装置
DE69032084T2 (de) * 1989-11-17 1998-07-16 Toshiba Kawasaki Kk Halbleiteranordnung mit zusammengesetzter Bipolar-MOS-Elementpille, geeignet für eine Druckkontaktstruktur
DE4227063A1 (de) * 1992-08-15 1994-02-17 Abb Research Ltd Abschaltbares Hochleistungs-Halbleiterbauelement
BE1007589A3 (nl) * 1993-10-01 1995-08-16 Philips Electronics Nv Halfgeleiderinrichting met in mesa-structuur aangebracht halfgeleiderelement.
WO2001001495A1 (en) * 1999-06-29 2001-01-04 Mitsubishi Denki Kabushiki Kaisha Power-switching semiconductor device
JP5040234B2 (ja) * 2006-09-26 2012-10-03 三菱電機株式会社 圧接型半導体装置
CN104600101A (zh) * 2015-02-03 2015-05-06 清华大学 一种集成门极换流晶闸管芯片的双门极接触环阴极面结构
DE102018102234B4 (de) 2018-02-01 2021-05-06 Infineon Technologies Bipolar Gmbh & Co. Kg Kurzschluss-Halbleiterbauelement
DE102019124695A1 (de) * 2019-08-01 2021-02-04 Infineon Technologies Bipolar Gmbh & Co. Kg Kurzschluss-Halbleiterbauelement und Verfahren zu dessen Betrieb
EP3925009B1 (en) 2020-02-25 2022-05-25 Hitachi Energy Switzerland AG Integrated gate-commutated thyristor (igct)
US12342559B2 (en) * 2020-03-31 2025-06-24 Hitachi Energy Ltd Turn-off power semiconductor device with gate runners

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3619738A (en) * 1969-10-13 1971-11-09 Tokyo Shibaura Electric Co Semiconductor device with improved connection to control electrode region
DE2103146A1 (de) * 1970-01-26 1971-08-05 Westinghouse Electric Corp Mittels einer Gate Elektrode Steuer bares Schaltelement
US3609476A (en) * 1970-06-26 1971-09-28 Gen Electric Interdigitated structures for gate turnoff thyristors and for transistors
US4079409A (en) * 1973-11-27 1978-03-14 Licentia Patent-Verwaltungs G.M.B.H. Thyristor with pressure contacting
JPS51121259A (en) * 1975-04-17 1976-10-23 Agency Of Ind Science & Technol Semiconductor device
JPS5737495Y2 (en]) * 1975-06-24 1982-08-18
JPS584815B2 (ja) * 1976-04-27 1983-01-27 三菱電機株式会社 半導体装置の製造方法
FR2378354A1 (fr) * 1977-01-19 1978-08-18 Alsthom Atlantique Procede de fabrication de semiconducteurs de puissance a contacts presses
JPS5929143B2 (ja) * 1978-01-07 1984-07-18 株式会社東芝 電力用半導体装置
JPS603791B2 (ja) * 1978-04-13 1985-01-30 株式会社東芝 メサ型ゲ−トタ−ンオフサイリスタ
JPS54136186A (en) * 1978-04-14 1979-10-23 Hitachi Ltd Semiconductor device
US4352118A (en) * 1979-03-02 1982-09-28 Electric Power Research Institute, Inc. Thyristor with segmented turn-on line for directing turn-on current
JPS55160437A (en) * 1979-05-31 1980-12-13 Hitachi Ltd Semiconductor device
JPS5945233B2 (ja) * 1979-08-01 1984-11-05 株式会社日立製作所 光点弧型半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0694964A2 (en) 1994-07-27 1996-01-31 Hitachi, Ltd. Semiconductor device and package structure therefor and power inverter having semiconductor device

Also Published As

Publication number Publication date
JPS56131955A (en) 1981-10-15
DE3134074A1 (de) 1982-05-06
DE3134074C2 (de) 1986-08-21
US4542398A (en) 1985-09-17

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